2 sided pcb (423) المصنع عبر الإنترنت
Key Words: High Density Interconnector
Feature: Immersion Silver
Minimum Hole Diameter: 0.10 Mm
Pcba Standard: IPC-A-610E
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Final Foil External: 1.oz
Surface Finishing: HASL/OSP/ENIG
Type: Copper Clad Laminate
Tensile Strength: Excellent,>300Mpa,1.2~1.6N/mm
Glass Epoxy: RO4730G3 0.762mm
Test: 100% Electrical Test Prior Shipment
Material: Rogers
Number Of Layers: 2 Layer, Multilayer, Hybrid PCB
طبقات: 12 طبقة
المواد: TACNIC TSM-DS3
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Glass Epoxy: RO4730G3 0.762mm
Board Thickness: 0.78mm
Thermal Conductivity: 0.24W/m-K
Application: E-car
Surfacefinish: ENIG, HASL, Gold Plating
Layercount: 1-4 Layers
Dielectricconstant: 7-9
Substratetype: Ceramic
طبقات: طبقة واحدة
المواد: SAR20H من Shengyi
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